MOLDEX-3D

Level up Your Smart Designs through Diversified Pre-processing and Mesh Tools

in Top Story on 10/04/2021

STMicroelectronics Used Moldex3D to Solve Void Issues During Chip Encapsulation Process

in Customer Success on 09/01/2021

Brand New Simulation Approach to Troubleshoot Various IC Encapsulation Processes

in Top Story on 08/31/2021

Solving the Unbalance Flow, Weld Line and Air Trap Issues at Once

in Customer Success on 08/02/2021

Quick Nozzle Modeling for 3D Barrel Compression Simulation in Moldex3D Studio

in Tips and Tricks on 07/29/2021

A Big Step for Foaming Simulation: Bubble Shrinkage No Longer Unpredictable

in Top Story on 07/28/2021

Digital Twin of Instrument Design and Material Measurement

in Material Digital Twin on 06/30/2021

A Good Task Management System Boosts Plastics Mold Development Efficiency

in Top Story on 06/29/2021