Strengthening the temperature analysis efficiency in the compression molding module, now capable of accurately simulating the temperature variations during module movement, yielding more rational outcomes.
RTM module offers more intelligent wizard tools and post-processors, allowing direct configuration of Ply properties, groups, and material sets. Additionally, it supports complete RTM model preprocessing, enabling direct RTM modeling within Moldex3D Studio.
Pioneering Electronic Potting Process simulation features provide more realistic and detailed visualization of adhesive dispensing head paths and feed, utilizing comprehensive physical models to simulate surface tension-induced phenomena, thereby achieving a more refined electronic potting process.
The IC packaging simulation enhances wire bonding process simulation and nonlinear post-curing warpage analysis, aiding users in enhancing product quality and effectively preventing potential defects.
Introduction of the Dual Nakamura model for more precise crystallinity calculation, along with the ability to export warpage deformation results as STEP models, facilitating easier assessment of mold compensation adjustments.
More precise simulation of annular runner and enabling direct adjustment of ribs and product thickness. It also supports additional gate, runner, and mesh repair tools, simplifying the grid construction process.
Optimization of welding line calculation efficiency, with support for the bilinear isotropic hardening model to calculate seam strength. Additionally, enhanced shrinkage prediction efficiency in injection molding and foam molding processes.
Streamlining of Moldex3D result outputs, resulting in storage space savings of up to 5-10%. Furthermore, optimization of Studio display cores, supporting OpenGL4 for clearer screen presentation and smoother operation.
Moldex3D iSLM introduces data information organization and management capabilities related to IC packaging. It also supports carbon footprint calculation functions, providing a clearer understanding of the product's carbon emissions.
Through the innovative Moldiverse cloud platform, access to the MHC, iMolding Hub and University is facilitated, making it easier to obtain the latest information and service integration in the plastics industry, thereby realizing digital transformation.