Moldex3D IC Packaging Overview

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Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.

Melt front result in mold

In Wire Sweep Analysis, deformed wires are compared with original wires based on the wire sweep


Product Portfolio and Features

● Essential features contained  ○ Optional features
Standard Package
Molding Process Transfer Molding
Mesh Technology
Cadence Interface
Simulation Capabilities  
Flow, Cure, Warp
Thermal Analysis
Wire Sweep
Paddle Shift
FEA Interface
Solver Capabilities  
Parallel Processing 8
Material Test  
Viscosity (Rheometer)
Curing Kinetics (DSC)
Solution Add-on
Molding Process Compression Molding Underfill Post Mold Cure
Molding Process
Compression Molding
No Flow Underfill (NUF)
Embedded Wafer Level Package (EWLP)
Capillary Underfill (CUF)
Molded Underfill (MUF)
Chemical shrinkage of material
Viscoelasticity stress relaxation
Material Test
Specific Volume (PVTC)
Visco-elastics Modulus (DMA)
Contact Angle  

System Requirements

A. Supported Platform
Platform OS
Windows / x86-64 Windows 10 family
Windows 8 family
Windows 7 family
Windows Server 2012 R2*
Windows Server 2016
B. Hardware Recommendation
CPU Intel® Core i7 Sandy Bridge series
RAM 16 GB RAM, and at least 1 TB of free space
CPU Intel® Xeon Platinum 8000 series
RAM 64 GB RAM, and at least 4 TB of free space

*: Update to KB2919355 or newer version required

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