IC Packaging Overview
Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) and Liquid Molding Compound (LMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.
Moldex3D provides a variety of IC packaging solutions for 2.5D and 3D IC stacking for the growing application of 3D IC stacking.
- Transfer molding
- Compression molding
- Capillary Underfill (CUF)
- No-flow Underfill (NUF)
- Molded Underfill (MUF)
- Non-conductive Paste (NCP)
- Embedded Wafer Level Package (EMWLP)
Melt front result in mold
Wire sweep
Incomplete fill
Moldex3D IC Packaging helps chip designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as wire sweep, die shift, filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.