MOLDEX-3D

Moldex3D Links 3D Mold Filling Simulation and 2.5D Structural Analysis to Build High Precision Thin-shell Parts

in Top Story on 04/14/2016

FARPLAS Using Moldex3D to Overcome Difficult Molding Issues in Multi-shot Injection Molding

in Customer Success on 03/20/2016

Utilizing Moldex3D’s Mold Deformation Analysis to Optimize Mold Designs

in Tips and Tricks on 03/17/2016

The Enhanced Moldex3D’s Simulation Capability Provides Accurate Sink Mark Predictions for Complex Geometries

in Top Story on 03/14/2016

Kyoto University Successfully Utilized Moldex3D to Validate New MuCell® Process

in Customer Success on 02/20/2016

Utilize Moldex3D’s Wire Sweep Analysis Result for IC Packaging Process to Avoid a Short Circuit Problem

in Tips and Tricks on 02/17/2016

Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technology

in Top Story on 02/14/2016

Improving Part Warpage and Shortening Cycle Time Successfully with Moldex3D

in Customer Success on 11/20/2015