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Assign Wire Materials Respectively to Predict Potential Defects in IC Packaging

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How To Evaluate Wire Sweep Issue Through Drag Force Distribution Analysis

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Setup Post Mold Curing Analysis for IC Packaging Simulation to Analyze Material’s Properties

in Tips and Tricks on 08/01/2016

Utilize Moldex3D’s Wire Sweep Analysis Result for IC Packaging Process to Avoid a Short Circuit Problem

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Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technology

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Moldex3D R13 Solver Helps Foresee Potential Wire Sweep Problem and Optimize Encapsulation Process

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Moldex3D IC Packaging Integration for Cadence

in Top Story on 08/14/2014
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