The distance between pairs of adjacent wires may vary and become smaller after the IC encapsulation process; when a wire deforms and contacts to another wire, it is susceptible to wire short problems. Therefore, a substantial wire sweep deformation should be avoided during the IC encapsulation process. A new feature in Moldex3D R13.0 is capable of analyzing the wire sweep problem which enables users to gain a more comprehensive understanding of this behavior in order to further optimize the IC encapsulation process.
Step 1. To perform a wire sweep analysis in Moldex3D, first click on the Encapsulation tab in the Computation Parameter setting window. Then, select Moldex3D as stress solver. Aside from Moldex3D Solver, the system also supports other stress analysis software like ANSYS and ABAQUS. Select ANSYS or ABAQUS for nonlinear stress analysis.
Step 2. Choose Wire sweep—WS in analysis sequence setting to run the analysis. After the analysis, the results of Distance to Closest Wire and Distance to Closest Wire (by wire) will be shown in Wire Sweep.
Step 3. The Distance to Closest Wire result shows the shortest distance from the node on each wire to another wire, displaying its distribution on the wire with a color scale. This will allow users to locate the potential wire short problem areas.
For Distance to Closest Wire (by wire) result shows the shortest distance from one individual wire to its nearest neighboring wire, displaying its result on the entire wires with a color scale. This will allow users to investigate the susceptibility of each wire to the occurrence of wire short problems.