Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technology

in Top Story on 02/14/2016

Moldex3D Warpage Analysis Allows Users to Check Differential Temperature and Differential Shrinkage Effects

in Tips and Tricks on 05/17/2015

Moldex3D R13 Now Includes Mold Deformation Analysis and Provides a Valuable Reference for Mold Design

in Top Story on 10/14/2014

CAE Simulation Technology Drives Opportunities for Sustainable Automotive Manufacturing

in Top Story on 01/14/2014

How to Accurately Measure Product Dimension through Warpage Analysis

in Tips and Tricks on 11/17/2013

Extreme Tool & Engineering Selects Moldex3D eDesign for Optimal Designs

in Customer Success on 10/16/2012

Widex Expands Quality Assurance Using Moldex3D, Significantly Reduces Volumetric Shrinkage

in Customer Success on 08/21/2012

SMPI Uses Moldex3D to Accurately Predict Product Problems

in Customer Success on 07/21/2012
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