Product Portfolio and Features
Standard Package | |
---|---|
Molding Process | Transfer Molding |
Mesh Technology |
|
Mesh | ● |
Designer | ● |
Cadence Interface | ○ |
Simulation Capabilities | |
Flow, Cure, Warp | ● |
Thermal Analysis | ● |
Stress | ● |
Wire Sweep | ● |
Paddle Shift | ● |
FEA Interface | ● |
Solver Capabilities | |
Project | ● |
Parallel Processing | 8 |
Material Test | |
Viscosity (Rheometer) | ● |
Curing Kinetics (DSC) | ● |
Solution Add-on | |||
---|---|---|---|
Molding Process | Compression Molding | Underfill | Post Mold Cure |
Molding Process |
Compression Molding No Flow Underfill (NUF) Embedded Wafer Level Package (EWLP) |
Capillary Underfill (CUF) Molded Underfill (MUF) |
Chemical shrinkage of material Viscoelasticity stress relaxation |
Material Test |
|||
Specific Volume (PVTC) | ● | ○ | ● |
Visco-elastics Modulus (DMA) | ○ | ○ | ● |
Contact Angle | ○ | ● |
System Requirements
A. Supported Platform
Platform | OS |
---|---|
Windows / x86-64 | Windows 10 family |
Windows 8 family | |
Windows 7 family | |
Windows Server 2012 R2* | |
Windows Server 2016 |
B. Hardware Recommendation
Minimum | |
---|---|
CPU | Intel® Core i7 Sandy Bridge series |
RAM | 16 GB RAM, and at least 1 TB of free space |
Recommended | |
CPU | Intel® Xeon Platinum 8000 series |
RAM | 64 GB RAM, and at least 4 TB of free space |
*: Update to KB2919355 or newer version required