MOLDEX-3D

Moldex3D Links 3D Mold Filling Simulation and 2.5D Structural Analysis to Build High Precision Thin-shell Parts

in Top Story on 04/14/2016

The Enhanced Moldex3D’s Simulation Capability Provides Accurate Sink Mark Predictions for Complex Geometries

in Top Story on 03/14/2016

Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technology

in Top Story on 02/14/2016

Pioneering Simulation Technology for Fiber Concentration Prediction Helps Achieve Your Lightweight Design Concept

in Top Story on 11/14/2015

Use Moldex3D’s New Pin Movement Analysis Technology to Yield Greater Process Gains

in Top Story on 10/14/2015

Visualize Resin Transfer Molding Behavior Using Advanced 3D CAE Technology

in Top Story on 09/14/2015

Moldex3D’s Hot Runner Steady Analysis Helps Design Your Most Optimal Hot Runner System Faster and Better

in Top Story on 08/14/2015

Expedite MuCell® Simulation Process with Simple Weight Reduction Ratio Set-up

in Top Story on 07/14/2015