MOLDEX-3D

SAMSUNG Electronics Introduced Moldex3D As The Standard CAE Tool For Injection Molding

in Customer Success on 01/25/2012

UTAC’s Report on Molded Underfill Technology Leveraged on Moldex3D and Won Best Paper of Session in IMAPS

in Customer Success on 01/21/2012

Leading Auto-parts Maker Maximized Competitiveness with Injection Molding Simulation

in Customer Success on 01/21/2012

Moldex3D Helps Grand Dynasty to Reduce Time to Market

in Customer Success on 04/25/2011

BTI and Moldex3D Provide The Most Advanced Solutions For Runner Design

in Customer Success on 04/21/2011

Moldex3D Successfully Lowered Chi Lin Technology’s Manufacturing Costs

in Customer Success on 04/21/2011

Moldex3D Facilitates MiTAC’s Designing Process

in Customer Success on 04/21/2011

Successful 3D Simulation of Decorative Parts

in Customer Success on 04/21/2011