Moldex3D IC Packaging Warp
Due to difference in thermal conductivity among components complexity, such as EMC, chips, wires, and lead frames, Warpage becomes a common problem and a critical factor in IC encapsulation process. Moldex3D IC Packaging Warp allows users to perform true 3D warpage analysis. Warpage prediction uses filling simulation and indicates the amount of deformation considering both thermal and cure induced shrinkage
Capabilities
- Evaluates the cure-induced shrinkage
- Evaluates the thermal-induced shrinkage
- Evaluates the stress-relaxation behavior
- Separates total displacement into x-axis, y-axis, and z-axis displacements to show the deformation in each direction
