FIRST PRIZE WINNER
Project Name: Integration of Moldex3D and ANSYS for Insert Molding Analysis of a Tablet Bottom Base Case Cover
Company: Pegatron Corporation
By Chih-Hsuan Ke, Ren-Hao Liao, Chia-Wei Lee
In order to create lighter, slimmer parts, Pegatron engineers were tasked to reduce the thickness of a tablet bottom base case cover from 1.5mm to 1mm and add a metal insert part, 0.5mm thickness, to the original design. Thin-wall molding can be challenging and create many problems such as filling imbalances and structural integrity. Pegatron engineers used Moldex3D simulation software to optimize mold designs, reduce shrinkage and validate the strength of the part through integration with FEA analysis.
- Short shots
- Air traps
- Shrinkage caused by different wall thickness
With the use of Moldex3D computer-aided engineering software, engineers at Pegatron were able to optimize gate locations and runner systems to prevent potential mold filling problems, such as short shots. Furthermore, Moldex3D assisted Pegatron in determining suitable air vents based on predicted air trap locations. Lastly, the team used Moldex3D Fiber analysis to help analyze the causes of warpage and its tendency, successfully reducing the Z-displacement by 92%. Moldex3D also allowed Pegatron to assure that the part strength requirements were met with the integration with ANSYS structural analysis.
- Met target part thickness of 1mm, reducing thickness by 23%
- Significantly reduced warpage by 92%
- Reduced pressure loss by 8.3%
- Reduced scrap by 13%
- Saved more than 6% of manufacturing costs with insert molding
Moldex3D Advanced Package
– FEA Interface