Moldex3D IC package

 Compression Molding

simulates the compression molding process in which the polymer is squeezed into a preheated mold cavity. Moldex3D helps users check potential defects resulted from heat and pressure, decide appropriate materials, and optimize process conditions.

 Underfill

simulates the compression molding process in which the polymer is squeezed into a preheated mold cavity. Moldex3D helps users check potential defects resulted from heat and pressure, decide appropriate materials, and optimize process conditions.

 Post Mold Cure

Post Mold Cure (PMC) is a significant process in IC Packaging industry. This process exposes part of a mold to elevated temperatures in order to speed up the curing process and to optimize some physical properties of the material.

 Cadence Interface

 Moldex3D supports import Cadence 3di file. Designer could save the full model, including epoxy region, chips, leadframe, wire and solar ball, etc, as the 3di file. User could import the file directly and the geometries could be modified.

 

 

 


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