- Date：Sep 21, 2023 - Sep 22, 2023
- Location： Europe
Get ready to be captivated by the most anticipated event of the year – Moldex3D Event TechConnect! Save the dates for September 21st and 22nd as we dig into cutting-edge insights and advancements in the realm of simulation technology.
Event Highlights
This immersive event is designed to revolve around two key themes: the Application Programming Interface (API) and Material Measurement. Join us as we explore these topics through a series of enlightening sessions and engaging discussions.
Unlocking the Power of API 9/21 (Registration Closed)
Distinguished speaker and expert in the field, Dr. Ellen Hu, will unveil the latest and most innovative features of Moldex3D’s Application Programming Interface (API). Discover how this robust interface can enhance your simulation processes, streamline workflow integration, and open doors to new possibilities. Through real-world examples, Dr. Hu will demonstrate how the API’s capabilities can transform ideas into tangible solutions, propelling your projects to new heights of efficiency and innovation.
Material Measurement 9/22:
Dive into the field of material measurement as we welcome two esteemed customers to the stage. These industry veterans will share their invaluable experiences and insights, shedding light on the significance of accurate material measurement in simulation and manufacturing. Dr. Joe Wang, a respected figure in the Moldex3D community, will guide us through the latest advancements and strategies in material measurement, providing attendees with a comprehensive understanding of this critical aspect.
Don’t miss out on this opportunity to enhance your understanding, network with industry peers, and stay ahead of the curve. Register now to secure your spot at this exceptional event.
Agenda
Day 1- September 21, 2023: Unlocking the power of API |
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| Time ( CEST/GMT+1) |
Topic | Presenter |
| 10:00-10:17 | Moldex3D Studio Automation and Intelligent Apps | Moldex3D – Ellen Hu |
| 10:17-10:25 | Q&A | Moldex3D – Ellen Hu |
| 10:25-10:45 | Find the bottleneck of your workflow and let Moldex3D API to help you out | Moldex3D – Ray Wu |
| 10:45-10:55 | Q&A | Moldex3D – Ray Wu |
Day 2- September 22, 2023: Material Measurement |
||
| Time ( CEST/GMT+1) |
Topic | Presenter |
| 10:00-10:45 | Application of the new Warpage algorithms in Moldex3D to shrinkage measurement of polyamide test plaques | Radici Group – Claudio Ghilardi |
| 10:45-10:50 | Q&A | Radici Group – Claudio Ghilardi |
| 10:50-11:15 | Glass fiber orientation for predictive mechanical part performance simulation | Domo Chemicals – Alexandre CHATELAIN |
| 11:15-11:20 | Q&A | Domo Chemicals – Alexandre CHATELAIN |
| 11:20-11:47 | Updates in Moldex3D Material Testing & Material Hub Cloud | Moldex3D – Joe Wang |
| 11:47-11:55 | Q&A | Moldex3D – Joe Wang |
Contact
Europe Team：Leonor / leonorhsu@moldex3d.com / 886-3-5600199-612
Marketing Team： Phoebe / mkt@moldex3d.com / 886-3-5600199-705