- Date：Jun 07, 2022
- Location： Online
- Time： 13:15-16:00 GMT+8
The semiconductor manufacturing industry has gone through several technological innovations in the past few decades, and each technological innovation has led to the goal of increasing production capacity and reducing costs; with the rise of the 5G and IOT era, the semiconductor manufacturing process has moved towards higher quality and technology once again. The transformation cycle of innovation, and the semiconductor manufacturing side will also benefit from the development of new technologies such as 5G, artificial intelligence (AI), cloud computing and big data analysis, virtual and augmented reality applications, and integrated knowledge networks, driving the semiconductor manufacturing industry. Towards the stage of “Industry 4.0”, “Smart Manufacturing” and “Industrial Internet of Things”.
This conference focuses on digital transformation and smart manufacturing, we will discuss the application of digital twin (Digital Twin) and artificial intelligence (AI) in the semiconductor manufacturing industry from different perspectives, including key technology trends, process challenges, corresponding process methods, materials, Simulation tool solutions, etc., discuss the prospects of semiconductor smart manufacturing in depth, and sincerely invite you to sign up!
Event Highlight
- Advanced package market and technology trend
- Material application and measurement on advanced package
- Digital transformation and smart manufacturing
Agenda
| Time | Topics | Presenter |
| 13:15-13:30 | Online Registration | |
| 13:30-14:00 | Heterogeneous Integration Trend and Structure Analysis | Dr. Dyi-Chung Hu CEO, SiPlus Co. |
| 14:00-14:30 | Introduction of Film Materials on Advanced Packaging | Dr. Teng-Kuei Chen Board of Directors, WaferChem Technology Co. |
| 14:30-15:10 | Digital Twin Data Management for IC packaging molding process | Dr. Jim Hsu Project Director, CoreTech System Co. |
| 15:10-15:50 | Advancing the frontiers IC simulation with accurate material properties | Dr. Joe Wang Manager at Moldex3D Material Measurement Center, CoreTech System Co. |
| 15:50-16:00 | Q&A | |
Biology of the presenters
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Dr. Dyi-Chung Hu Si Dr. Dyi-Chung Hu earned Ph. D. degree from MIT in Material Science and Engineering Department in 1984. He has extensive experience in semiconductor packaging, TFT LCD display and IC substrate development. He has over 100 patents in above fields. He holds various engineer and management positions. He is also cofounder of two TFTLCD display companies in Taiwan. And he has ever been a Senior Executive Advisor for next generation substrate development in Unimicron. He is currently the CEO of SiPlus Co. (www.si2plus.com). Develop semiconductor heterogeneous integration platform and process. Especially die-last solution of “Integrated Substrate”. Integrates BEOL, thin film RDL and laminated substrate to be “one” integrated substrate for die-last applications. The solutions developed; 2.0D, 2.1D, 2.2D, and 2.3D with the process and IP protection |
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Dr. Teng-Kuei Chen
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Dr. Jim Hsu Jim received his PhD degree in Chemical Engineering from Tsing-Hua University in Taiwan. He is currently the leader of solver development in R&D division of CoreTech System Co., Ltd. During the past years, Jim Worked closely with customers on the technical requirements to provide technical solutions – Identified requirements, including technical details sufficient for product definition. He is responsible for developing the numerical tool to simulate the molding process such as Composite molding simulation, multi-components molding simulation and IC Packaging simulation which calculate the multi-physics behaviors for fluid dynamics, viscoelastic stress relaxation and structure deformations. Spearhead the development project with team to construct numerical models and user workflow to deliver efficient and accurate software functionalities. He has over thirty technical papers and some US patents on the area of polymer processing like injection molding process, fluid-assisted injection molding and IC packaging. |
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Dr. Joe Wang
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Contact
- Sales & Technical Contact
Steven Lin
stevenlin@moldex3d.com
- Event & Marketing Contact
Claire Yang
claireyang@moldex3d.com