Why Compression Molding?

Compression Molding is a process in which a molding polymer, called charge or compound, is squeezed into a preheated mold cavity under heat and pressure until the charge has cured. The process is a high-volume-production and low-cost molding method, suitable for parts with complex appearance, high strength, or high impact resistance.

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Compression molding enables the production of complex composite components at fast rate, Moldex3D supports many discontinuous FRP materials that frequently used in compression molding including thermoplastics material GMT, LFT-G and LFT-D. Thermoset type is also supported by Moldex3D, such as SMC and BMC materials.

Challenge

  • Proper amount of material
  • Predict the required force to ensure that shot attaining the proper shape
  • Provide appropriate compression parameters to assure quality compression effects
  • Design the mold for heating or cooling after the material has been compressed into the mold
  • Detect potential flash issue
  • Achieve product consistency control

What Can Moldex3D Do?

  • Simulate the filling process with single or multiple charge design
  • Visualize pressure distribution, volume shrinkage, residual stress, fiber orientation distribution, etc.
  • Predict potential molding defects, such as bleeding or flashing
  • Optimize process conditions, such as compression speed, force, or mold temperature
  • Support fiber orientation analyses
  • Support parallel processing to speed up the simulation
  • Support the molding simulation of single or multiple charge design

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One-Charge Design

Two-Charge Design
  • To fulfill more accurate prediction of large deformation during compression molding process, Moldex3D can support LS-Dyna (R15.0 and newer versions). This integration allow user to seamlessly import initial temperature that calculated by LS-Dyna in initial charge deformation process for next compression molding analysis in Moldex3D. The key feature are
    • Support LS-Dyna material card that enable large deformation prediction with EFG method.
    • Allow user to import initial temperature calculated by LS-Dyna.
    • Allow user to define fiber orientation of initial charge.

Applicable Industries

  • Automotive
  • Electronics
  • Consumer Product

Applicable Moldex3D Package

  • Moldex3D Advanced package

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