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- Date
- Title
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- 07/24/2015
- Moldex3D Selects Winners of Global Innovation Talent Award Contest
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- 06/22/2015
- Moldex3D Wins Prestigious James L. White Innovation Award for 2015 of the Polymer Processing Society (PPS)
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- 04/02/2015
- Moldex3D’s $1.625 Million Gift to Boost Education and Research at CU-ICAR
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- 03/19/2015
- Moldex3D Witnessed a Strong Growth in Indian Market at Plastindia 2015
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- 11/20/2014
- Moldex3D eDesignSYNC Integrating PLM Brings Efficiency and Best Solutions to Plastics
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- 08/25/2014
- Moldex3D Unveils New IC Packaging Simulation Solutions at SEMICON Taiwan 2014
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- 06/27/2014
- CoreTech System Announces Moldex3D R13.0: Best-in-class Industry-oriented Simulation Solutions
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- 05/27/2014
- Moldex3D Celebrated Grand Opening of a New Moldex3D Office in Bangkok, Thailand
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- 05/21/2014
- Moldex3D Exhibits at DAC 2014 and Unveils New IC Packaging Simulation Features
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- 05/19/2014
- CoreTech System and BETA CAE Systems Announce the Coupling of ANSA and Moldex3D
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- 04/11/2014
- Moldex3D’s Presence at This Year’s ANTEC® 2014 in Las Vegas on April 28-30, 2014
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- 02/14/2014
- Moldex3D Becomes TURQUALITY® Accredited Consultancy Company
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- 12/16/2013
- Moldex3D Announced the Winners of 2013 Moldex3D Global Innovation Talent Award Contest
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- 11/18/2013
- Moldex3D Partnered with Industry Leading Companies at the Molding Innovation Technical Forum, and Received Overwhelming Enthusiasm from Show Attendees at K 2013
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- 10/15/2013
- CoreTech System Receives US Patent for Three-parameter Fiber Orientation Model