Moldex3D Technology Conference (MTC) 2019

  • Date:Jun 18, 2019 - Jun 19, 2019
  • Location: Shanghai, China

Moldex3D Technology Conference (MTC) is the global leading plastics engineering simulation conference, where hundreds of engineering professionals and industry experts gather to bring you in-depth insights on the challenges and opportunities awaiting the plastics engineering community. Dr. Andreas Wonisch of BASF had even stated a positive comment about MTC, “Thanks for the great conference in Paris, it provided me with some valuable insights. My student also enjoyed the conference a lot and got some good new contacts.”

This year, we’re moving to an exciting location, Shanghai, the biggest economic center in China, where intelligent manufacturing is a key priority for growth and transformation. Join hundreds of engineering professionals to map out the future of intelligent plastics engineering. See you at MTC 2019, 18-19 June, 2019, at the InterContinental Shanghai Pudong Hotel, Shanghai, China.

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Top 5 Reasons to Attend MTC 2019

  • Hear from the technological advancements and innovative numerical simulation methods adopted by top-notch experts from leading companies
  • Keep pace with the ever-changing market trends, customer demands and technological landscape
  • Be the first to see and experience Moldex3D’s next-gen plastics simulation solutions
  • Discover new best practices and strategies to help you accelerate product innovations
  • Network with more than 200 of the best minds in the plastics industry around the globe, including key decision makers, product engineers and designers, process engineers, mold makers, and more

MTC 2018 – Post-Event Video >>

Conference Experience

Thanks for the great conference in Paris, it provided me with some valuable insights. My student also enjoyed the conference a lot and got some good new contacts.
– Dr. Andreas Wonisch, BASF


MTC 2018 program was very interesting; the speakers were very professional and have high level expertise in their field. The conference was very well organized; the Moldex3D team did his best! Thank you!
– Dr. BELEZNAI Róbert, Bay Zoltán

I’d like to say, that I was really astonished with the organization level of the MTC. It was really a great event – perfectly organized. Your MTC is really an unreachable organizational standard for others. Keep up the best work you’re doing.
– Przemysław Narowski, Dr. Schneider


The idea of getting “presents” for visiting exhibitors is great! It really promotes networking. And also, having the exhibitors in the same area as snacks, coffee and such is also great for networking.
– Solymossy Balázs, Robert Bosch Kft.

Past Featured Speakers 


DAY 1: Tuesday, June 18, 2019

Time Session Presenter
08:20 – 08:50 Registration  
08:50 – 09:00 Opening  
09:00 – 09:40 Improve warpage prediction due to cooling conditions Samsung Electronics│Korea
Joonsung Tae
09:40 – 10:20 Automatic quick flow for part optimization based on Moldex3D API tools BASF│China
Jin Jing
10:20 – 11:00 2K-ICM Simulation Framework to Enable Design Optimization for Surface Aesthetics SABIC│India
Raghavendra Janiwarad
11:00 – 11:10 Award Ceremony  
11:10 – 11:30 Coffee Break / MTC Exhibition  
11:30 – 12:00 Process Transfer with Moldex3D Simulation for Smart Manufacturing RJG, Inc│U.S.A.
Doug Espinoza
12:00 – 12:30 Flow-fiber coupled viscosity induced mold filling imbalance Dr. Schneider│Poland
Przemyslaw Narowski
12:30 – 13:30 Lunch / MTC Exhibition  
13:30 – 14:00 Use the Carbon-Fiber Orientation Stress analysis on Hammer Tacker Stanley Black & Decker│Taiwan
William Lai
14:00 – 14:30 Flow pattern analysis & Warpage verification of automotive connectors using Moldex3D Hirose│Korea
YongSoo Jung
14:30 – 15:00 Approach to high accuracy in Moldex3D Asahi Kasei│Vietnam
Inaba Hideyuki
15:00 – 15:30 Improvement of anti-vibration product quality through analysis of Moldex3D Pyung Hwa Industry│Korea
DongHyung Lee
15:30 – 15:50 Coffee Break / MTC Exhibition  
15:50 – 16:20 Application of Molding Analysis to Improve Corner Effects Caused by Valve Gate Hot Runner Systems Free-Free Industrial Corp.│Taiwan
Young Lu
16:20 – 16:50 Comparison of CAE and parts using Moldex3D foaming analysis Kolon Plastics│Korea
TaeCheal Kim
16:50 – 17:00 GITA Award Ceremony  
17:00 – 18:00 Aperitif / MTC Exhibition  

DAY 2: Wednesday, June 19, 2019

Time Session Presenter
08:50 – 09:00 Opening  
09:00 – 09:40 Injection moulding simulation at LEGO System A/S in 2025 LEGO│Denmark
Brian Keith Sørensen
Patrick Guerrier
09:40 – 10:20 Simulation for Vehicle display part with ICM and IML technology LG Electronics│Korea
HyunGyu Lee
10:20 – 10:30 Award Ceremony  
10:30 – 10:50 Coffee Break / MTC Exhibition  
10:50 – 11:20 Investigation on Effect of Tear Seam Angle and Injection Direction on the Properties of Tear Seam based on A Square Plate Autoliv│China
Yanhua Li
11:20 – 11:50 Improving warpage prediction for engineering plastics DSM│Taiwan
Shelly Chen
11:50 – 12:20 Welding Lines location and conditions: how to account for their weakening effect in CAE Radici Group│Italy
Carlo Grassini
12:20 – 13:30 Lunch / MTC Exhibition  
13:30 – 14:00 Simulation with thermosets – some important remarks Schwarz Plastic Solutions│Germany
Ingo Schwarz
14:00 – 14:30 Car side window Encapsulation process Dura Automotive │India
Bhargav Nadinla
14:30 – 15:00 Numerical analysis on the warpage of shell products for optimization via Moldex3D TE Connectivity│China
Hubert Chen
15:00 – 15:30 A robust, fast and easy way to integrate manufacturing effects into FEA MSC Software│China
Weizhuo Du
15:30 – 16:00 Moldex3D R17 & Future Development Moldex3D
David Hsu
16:00 – 16:30 Farewell & Tea Break  


About MTC 2018 >>

About MTC 2017 >>


InterContinental Shanghai Pudong
No.777 Zhangyang Road, Pudong New Area : Shanghai, China

Recommended Accommodations

Hotel Name Walking Distance from the Event Venue
 InterContinental Shanghai Pudong
Event Venue
 Grand Trustel Purple Mountain Shanghai
6 mins
 All Seasons Hotels
4 mins
 Yatour Hoel Pudong
9 mins
 Supreme Tower
9 mins
 Zhongdian Hotel
9 mins
 Shanghai Baoan Hotel
8 mins
 Courtyard by Marriott Shanghai Pudong
11 mins

Registration Fee

【Moldex3D User】

Early Bird Rate (Prior to 30th April)

Regular Rate
CNY 1,000 CNY 1,300

【Non Moldex3D User】

Early Bird Rate (Prior to 30th April)

Regular Rate
CNY 1,500 CNY 1,800

Payment Method

Wire Transfer

Credit Card Authorization Form

*Please send the transfer payment proof or credit card form to Kate Chan after finishing the payment, thank you.


Kate Chan
+886-3-5600199 ext. 715

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