- Date:Jun 18, 2019 - Jun 19, 2019
- Location: Shanghai, China
Moldex3D Technology Conference (MTC) is the global leading plastics engineering simulation conference, where hundreds of engineering professionals and industry experts gather to bring you in-depth insights on the challenges and opportunities awaiting the plastics engineering community. Dr. Andreas Wonisch of BASF had even stated a positive comment about MTC, “Thanks for the great conference in Paris, it provided me with some valuable insights. My student also enjoyed the conference a lot and got some good new contacts.”
This year, we’re moving to an exciting location, Shanghai, the biggest economic center in China, where intelligent manufacturing is a key priority for growth and transformation. Join hundreds of engineering professionals to map out the future of intelligent plastics engineering. See you at MTC 2019, 18-19 June, 2019, at the InterContinental Shanghai Pudong Hotel, Shanghai, China.
Become a Sponsor e-Brochure Register Now 中文版活动网页 |
Top 5 Reasons to Attend MTC 2019
- Hear from the technological advancements and innovative numerical simulation methods adopted by top-notch experts from leading companies
- Keep pace with the ever-changing market trends, customer demands and technological landscape
- Be the first to see and experience Moldex3D’s next-gen plastics simulation solutions
- Discover new best practices and strategies to help you accelerate product innovations
- Network with more than 200 of the best minds in the plastics industry around the globe, including key decision makers, product engineers and designers, process engineers, mold makers, and more
MTC 2018 – Post-Event Video >> |
Conference Experience
Thanks for the great conference in Paris, it provided me with some valuable insights. My student also enjoyed the conference a lot and got some good new contacts. |
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MTC 2018 program was very interesting; the speakers were very professional and have high level expertise in their field. The conference was very well organized; the Moldex3D team did his best! Thank you! |
I’d like to say, that I was really astonished with the organization level of the MTC. It was really a great event – perfectly organized. Your MTC is really an unreachable organizational standard for others. Keep up the best work you’re doing. |
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The idea of getting “presents” for visiting exhibitors is great! It really promotes networking. And also, having the exhibitors in the same area as snacks, coffee and such is also great for networking. |
Past Featured Speakers
Agenda
DAY 1: Tuesday, June 18, 2019
Time | Session | Presenter |
08:20 – 08:50 | Registration | |
08:50 – 09:00 | Opening | |
09:00 – 09:40 | Improve warpage prediction due to cooling conditions | Samsung Electronics│Korea Joonsung Tae |
09:40 – 10:20 | Automatic quick flow for part optimization based on Moldex3D API tools | BASF│China Jin Jing |
10:20 – 11:00 | 2K-ICM Simulation Framework to Enable Design Optimization for Surface Aesthetics | SABIC│India Raghavendra Janiwarad |
11:00 – 11:10 | Award Ceremony | |
11:10 – 11:30 | Coffee Break / MTC Exhibition | |
11:30 – 12:00 | Process Transfer with Moldex3D Simulation for Smart Manufacturing | RJG, Inc│U.S.A. Doug Espinoza |
12:00 – 12:30 | Flow-fiber coupled viscosity induced mold filling imbalance | Dr. Schneider│Poland Przemyslaw Narowski |
12:30 – 13:30 | Lunch / MTC Exhibition | |
13:30 – 14:00 | Use the Carbon-Fiber Orientation Stress analysis on Hammer Tacker | Stanley Black & Decker│Taiwan William Lai |
14:00 – 14:30 | Flow pattern analysis & Warpage verification of automotive connectors using Moldex3D | Hirose│Korea YongSoo Jung |
14:30 – 15:00 | Approach to high accuracy in Moldex3D | Asahi Kasei│Vietnam Inaba Hideyuki |
15:00 – 15:30 | Improvement of anti-vibration product quality through analysis of Moldex3D | Pyung Hwa Industry│Korea DongHyung Lee |
15:30 – 15:50 | Coffee Break / MTC Exhibition | |
15:50 – 16:20 | Application of Molding Analysis to Improve Corner Effects Caused by Valve Gate Hot Runner Systems | Free-Free Industrial Corp.│Taiwan Young Lu |
16:20 – 16:50 | Comparison of CAE and parts using Moldex3D foaming analysis | Kolon Plastics│Korea TaeCheal Kim |
16:50 – 17:00 | GITA Award Ceremony | |
17:00 – 18:00 | Aperitif / MTC Exhibition |
DAY 2: Wednesday, June 19, 2019
Time | Session | Presenter |
08:50 – 09:00 | Opening | |
09:00 – 09:40 | Injection moulding simulation at LEGO System A/S in 2025 | LEGO│Denmark Brian Keith Sørensen Patrick Guerrier |
09:40 – 10:20 | Simulation for Vehicle display part with ICM and IML technology | LG Electronics│Korea HyunGyu Lee |
10:20 – 10:30 | Award Ceremony | |
10:30 – 10:50 | Coffee Break / MTC Exhibition | |
10:50 – 11:20 | Investigation on Effect of Tear Seam Angle and Injection Direction on the Properties of Tear Seam based on A Square Plate | Autoliv│China Yanhua Li |
11:20 – 11:50 | Improving warpage prediction for engineering plastics | DSM│Taiwan Shelly Chen |
11:50 – 12:20 | Welding Lines location and conditions: how to account for their weakening effect in CAE | Radici Group│Italy Carlo Grassini |
12:20 – 13:30 | Lunch / MTC Exhibition | |
13:30 – 14:00 | Simulation with thermosets – some important remarks | Schwarz Plastic Solutions│Germany Ingo Schwarz |
14:00 – 14:30 | Car side window Encapsulation process | Dura Automotive │India Bhargav Nadinla |
14:30 – 15:00 | Numerical analysis on the warpage of shell products for optimization via Moldex3D | TE Connectivity│China Hubert Chen |
15:00 – 15:30 | A robust, fast and easy way to integrate manufacturing effects into FEA | MSC Software│China Weizhuo Du |
15:30 – 16:00 | Moldex3D R17 & Future Development | Moldex3D David Hsu |
16:00 – 16:30 | Farewell & Tea Break |
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About MTC 2018 >>
About MTC 2017 >>
Venue
InterContinental Shanghai Pudong
No.777 Zhangyang Road, Pudong New Area : Shanghai, China
Recommended Accommodations
Hotel Name | Walking Distance from the Event Venue |
上海錦江湯臣洲際大酒店 InterContinental Shanghai Pudong |
Event Venue |
紫金山大酒店宴會廳 Grand Trustel Purple Mountain Shanghai |
6 mins |
全季酒店(上海陸家嘴八佰伴店) All Seasons Hotels |
4 mins |
上海陸家嘴八佰伴亞朵酒店 Yatour Hoel Pudong |
9 mins |
明城花苑酒店健身中心 Supreme Tower |
9 mins |
上海中電大酒店 Zhongdian Hotel |
9 mins |
上海宝安大酒店 Shanghai Baoan Hotel |
8 mins |
上海齊魯萬怡大酒店 Courtyard by Marriott Shanghai Pudong |
11 mins |
Registration Fee
【Moldex3D User】
Early Bird Rate (Prior to 30th April) |
Regular Rate |
CNY 1,000 | CNY 1,300 |
【Non Moldex3D User】
Early Bird Rate (Prior to 30th April) |
Regular Rate |
CNY 1,500 | CNY 1,800 |
Payment Method
Credit Card Authorization Form
*Please send the transfer payment proof or credit card form to Kate Chan after finishing the payment, thank you.
Contact
Kate Chan
mkt@moldex3d.com
+886-3-5600199 ext. 715