August 25, 2014- Hsinchu, Taiwan– CoreTech System (Moldex3D) is going to exhibit the latest suite of simulation solutions for IC Packaging at “Semicon Taiwan 2014” from September 3 to September 5, 2014 in TWTC Nankang Exhibition Hall. Moldex3D’s simulation solution includes 2.5D to 3D IC stacking underfill process, which can fulfill the needs of both designing and manufacturing fields.
“It ensures validation and optimization of a complex microchip encapsulation process, in which a proper runner and gate design is also included and verified,” said Dr. Venny Yang, President of CoreTech System.
Moldex3D IC Packaging analysis has enabled an interface for users of Cadence EDA tool to further enhance the packaging design-to-manufacturing process. Furthermore, Moldex3D also has integrated with ANSYS and ABAQUS. Users are able to import Moldex3D’s simulation results to these two systems for post-processing. With pioneering 3D dynamic flow visualization technology, potential defects such as wire sweep, paddle shift, voids, warpage, and residual stress relaxation can be predicted and well-addressed upfront prior to actual manufacturing.
Moldex3D IC Packaging
The Moldex3D IC Packaging module is a fully integrated analysis environment connecting pre-processing, post-processing, packaging simulation and structural analyses for microchip encapsulation. One of the major challenges for 3D modeling of microchip encapsulation is generating a suitable mesh for simulation analysis. In Moldex3D pre-processor, an efficient mesh generator with high-quality and arbitrary grid type (for example, tetra, hexa, wedge, pyramid or boundary layer elements) allows meshing of the complete package geometry with minimal model simplification.
In addition, a parametric capability facilitates a proper mesh creation for delicate IC wires, thereby greatly saving time and efforts spent on mesh preparation. Moreover, Moldex3D can calculate the resin flow considering nonlinearities such as viscosity change of epoxy molding compound during both in-mold and post-mold curing process.
New Moldex3D Simulation Features at SEMICON TAIWAN 2014
- Cadence Interface: Moldex3D supports users to import Cadence model (*.3di) directly in Moldex3D Designer and Mesh for any complex IC packages design.
- Underfill Process: Moldex3D provides a variety of solutions for underfill process from 2.5D to 3D IC stacking, such as Capillary Underfill (CUF), No-flow Underfill (NUF), Molded Underfill (MUF), Non-conductive Paste (NCP), Non-conductive Film (NCF), etc., for the growing applications of 3D IC stacking
- Post-mold Curing Process: Moldex3D provides post-mold curing simulation for warpage validation in IC encapsulation process. Moldex3D accurately controls residual stress and predicts the amount of warpage while considering both thermal and cure shrinkage
At booth #1341 of Semicon Taiwan 2014, Moldex3D will demonstrate the strong capabilities of their simulation solutions, and unveil the latest Moldex3D features for IC Packaging industry. With Moldex3D’s simulation solutions, the product quality and the process efficiency of IC packaging industries will be effectively enhanced.
About CoreTech System (Moldex3D) Co., Ltd.
CoreTech System (Moldex3D) Co., Ltd. has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995. Moldex3D IC Packaging provides a comprehensive suite of simulation solutions that help IC designers/engineers simulate the complex chip encapsulation process, validate mold design, and optimize process conditions. It helps designers/engineers fully analyze the microchip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as underfill encapsulation, post-molding annealing, stress distribution, and structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance microchip quality and prevent potential defects more efficiently.