Hsinchu, Taiwan — July 2, 2025 — CoreTech System Co., Ltd. (Moldex3D) recently presented a technical paper at the prestigious Electronic Components and Technology Conference (ECTC). The paper, titled “Advanced Packaging Techniques: Hybrid Numerical and Experimental Analysis of Underfill Flow in Fine Pitch Multi-Chip Modules,” showcases the successful use of simulation and experimental validation to accurately predict underfill flow behavior in fine-pitch multi-chip packaging, highlighting Moldex3D’s high precision and reliability in advanced packaging applications.
Co-authored by Srikar Vallury, Leo Shen, Ching-Kai Chou, Zi-Hsuan Wei, Wei-Yu Lin, and Yu-En Liang from Moldex3D, along with Kazuki Noguchi from Sanyu Rec Co., Ltd., the study introduces an innovative hybrid-dimensional simulation strategy that addresses the trade-off between accuracy and efficiency in the underfill process for high-density, multi-chip packaging structures such as CoWoS.
Traditionally, building a full 3D model with hundreds of thousands of bumps ensures accuracy but requires excessive computation time and resources. To overcome this limitation, the Moldex3D team developed two key efficiency-enhancing strategies:
- Hybrid-dimensional Modeling: This approach reduces the number of mesh layers in the thickness direction of the underfill region, significantly lowering the computational load. It is particularly effective for single- or few-chip packages with fewer than 10,000 bumps, achieving a good balance between simulation speed and precision.
- Equivalent Bump Group (EBG) Modeling: For multi-chip modules with more than 10,000 bumps, the EBG model further simplifies horizontal geometry and mesh density. When combined with hybrid-dimensional modeling, it dramatically reduces overall simulation cost while maintaining high accuracy.
To validate the results, the team created transparent test vehicles using glass-based substrates. Underfill behavior was observed on both 10-chip and 12-chip modules, and the results were compared with simulations. The outcomes showed strong agreement between the predicted and actual flow behavior and confirmed that optimized dispensing strategies could significantly reduce fill time and mitigate defect risks.
Comparison between the simulation and experimental results at different time points of the 10-chip MCM package.
The study not only demonstrates Moldex3D’s evolving simulation capabilities but also reflects its commitment to integrating digital simulation with real-world validation—empowering engineers to address future packaging challenges with smarter, more efficient solutions. Looking ahead, Moldex3D will continue to advance electronic packaging simulation technologies toward a future of greater intelligence, accuracy, and reliability.
About CoreTech System (Moldex3D)
CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995, and the current product “Moldex3D” is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI). More information can be found at Moldex3D Website.