on 10/19/2018

Balázs Solymossy, BOSCH

Thermoset Process Simulation at BOSCH


  • IC encapsulation process might be unfamiliar with many, while its importance is without doubt as it plays an essential part forming the digital world nowadays.
  • In this presentation, a general overview is provided to show insights of different IC packaging processes.  Furthermore, what being required for a simulation tool to approach the real world scenario is carefully and methodically covered so as to unveil the mystery of encapsulation processes.



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