on 11/18/2016

fy17-moldex3d-apac-channel-sales-kick-off

Don’t Miss the FY’17 Moldex3D APAC Channel Sales Kick-off

KEEP SUCCESS ROLLING.

The FY’17 Moldex3D APAC Channel Sales Kick-off is scheduled for February 20-22, 2017 at the Ambassador Hotel in Hsinchu Taiwan. This premier event will bring together senior executives and sales teams from Moldex3D and our top channel partners across APAC to explore the game-changing insights and latest product innovations, to help you position for greater growth and profitability.

At the FY’17 APAC Channel Sales Kick-off, besides participating in general sessions on Feb.20-21, partners can get hands-on trainings in how to apply new product knowledge on Feb. 22.Don’t miss out on this opportunity to keep your success rolling in 2017! Register Now >>

 


Agenda

DAY 1: Monday, Feb. 20, 2017
10th Floor, Ballroom B, Ambassador Hotel Hsinchu

 

DAY 2: Tuesday, Feb. 21, 2017
10th Floor, Ballroom B, Ambassador Hotel Hsinchu

Time Session
08:30 AM Check-in
09:00 AM Moldex3D Vision
09:10 AM Product Roadmap: What’s Next?
10:10 AM Tea Break
10:40 AM How We Grew Our Business in 2016 & How to Sell in 2017
11:20 AM Moldex3D Material Research Center
11:50 AM Networking Lunch
01:20 PM Competition Update
02:20 PM Moldex3D Online Certificate Program
02:40 PM Key Success Stories of the Year: Korea
03:10 PM Key Success Stories of the Year: Japan
03:40 PM Tea Break
04:10 PM Key Success Stories of the Year: Philippines
04:40 PM Key Success Stories of the Year: India
05:10 PM Welcome Dinner
 
Time Session
08:30 AM Check-in
09:00 AM Moldex3D Lightweight Solutions Overview
10:00 AM Deep Dive into Moldex3D R15
Part I: New Innovations (Solver & Modules)
10:40 AM Tea Break
11:10 AM Part II: Mesh Enhancements
– Designer BLM & Non-matching 2.0
– New Runner Technology
11:40 AM Part III: Usability Enhancements
– Studio
12:10 PM Networking Lunch
01:40 PM How Moldex3D Beat Moldflow in Greater China Market
02:40 PM Partner Award Ceremony & Light Refreshments
04:00 PM Happy Hour: Moldex3D Bowling Challenge
Location: 8th Floor, Big City Mall
06:00 PM Partner Award Dinner

 

DAY 3: Wednesday, Feb. 22, 2017
CoreTech System Headquarters

   
Time Session
09:30 AM Check-in
10:00 AM Pre-processor
10:50 AM Break
11:10 AM Solver
12:00 PM  Lunch
01:30 PM Project Management & Post-processor
02:20 PM Solution Add-on (Part. I)
02:50 PM Break
03:10 PM Solution Add-on (Part. II)
03:40 PM Discussion & Wrap-up
   

*This is a preliminary agenda. Sessions are subject to change.

 


Venue

The Ambassador Hotel Hsinchu (10th Floor, Ballroom B)
www.ambassadorhotel.com.tw

No.188, Sec. 2, Zhonghua Rd., Hsinchu City, Taiwan
T +886(3) 515-1111 │ F +886(3) 515-1112

Screen shot 2016-11-27 at 10.43.40 PM


Hotel

~ Block rooms are limited, book before 12/30! ~
We have secured a block of rooms for registered partners at the Ambassador Hotel Hsinchu at a special discounted rate of NT$4,000 per night (1 person buffet breakfast, taxes and service changes included) for Deluxe King RoomsThe special rate will be available from 2/19-2/22, 2017. To secure your stay at our venue hotel, please fill out the form below

Cancellation Policy: Any cancellation made after 7 days before the arrival date will result in a cancellation fee: 3-6 days before the arrival date results in a charge of 30% of the stay; 2-3 days before arrival will result in a charge of 50% of the stay; cancellation on the day of arrival, no show, or departure prior to the scheduled date will result in a charge of the 100% of the stay.

NOTE: If you will NOT be staying at the Ambassador Hotel Hsinchu, please make your own hotel reservations.

Screen shot 2016-11-27 at 10.35.19 PM


Travel Arrangements

You are responsible for arranging your own travel to/from the airport to the hotel. For all transportation options, please see the information here. Travel and accommodation costs are to be borne by participants. If you need to apply for a visa, please contact your channel sales manager at Moldex3D.


Contact

Carolyhn Ren
carolyhnren@moldex3d.com
Marketing Deputy Manager
T 886 3 560 0199 #705 │F 886 3 560 0198


Registration

The event is over.

 

Photo Gallery

 

Test drive Moldex3D

Join the thousands of companies using Moldex3D

Talk to Sales

Schedule a product demo with our sales team