Webinar: Overview of IC Packaging and Encapsulation Simulation Technologies

  • Date:Feb 09, 2022
  • Location: Americas
  • Time: 2:30 PM EST

2:30 PM EST | Wednesday, February 9, 2022 | Check Your Time

Semiconductor chips and packages have become an integral part of our lives. Understanding the impact of IC packaging / encapsulation manufacturing process on the quality and performance of chips helps improve designs and reduce lead times. This webinar focuses on how the latest simulation technology can help designers and engineers understand and navigate the different manufacturing processes and potential defects in IC packages.

What will you learn:

  • What are the different processes followed in the industry for IC packaging and encapsulation
  • How to use simulation to identify potential defects in encapsulation processes
  • Correlation between simulation and molded parts

Don’t Miss Our Upcoming Webinars!

2022/05/112:30 PM EDTShrinkage and Warpage, Cause and Solution
2022/05/252:30 PM EDTUnderstanding Shear Stress & Shear Rate as a Simulation Output

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