- Date：Jul 22, 2020
- Location： 10:00 AM CEST/ 1:30 PM IST
10:00 AM CEST/ 1:30 PM IST | Wednesday, July 22, 2020 | Check Your Time
Part thickness variation and uneven shrinkage are the main cause of sink mark and voids. The key to tackle this surface quality problems is improving the mold design, such as changing the cooling layout, moving gate location or changing the gate diameter, and modifying process setting, such as increasing packing time, decreasing the melt temperature, increasing cooling time, etc. Moldex3D takes role in the solution by providing the sink mark indicator, so that the engineer can do the analysis to find the best mold design and the process setting. In this webinar, you will learn from the various real cases about how to take advantage of Moldex3D in discovering solution for sink mark and voids.
What will be covered in this webinar:
- What are sink marks and voids?
- Moldex3D sink mark simulation capabilities & analysis
- Case studies
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