Webinar: Advanced IC Package Simulation in Moldex3D

in Webinar on 09/13/2021
  • Date:Oct 27, 2021
  • Location: Europe, Asia Pasific
  • Time: 10:00 AM CEST / 1:30 PM IST

10:00 AM CEST / 1:30 PM IST | Wednesday, October 27, 2021 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.

 

Plastic chip encapsulation is a molding process where chips are being capsulated with epoxy molding compound (EMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.
Moldex3D IC Packaging Simulation helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing requirements, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, and structural evaluation. Significant molding problems can be predicted and solved upfront, helping engineers enhance chip quality and prevent potential defects more efficiently.

What You Will Learn

  • What’s New in Moldex3D 2021 IC Packaging
  • IC Packaging functionality and result interpretation
  • The advantage of Moldex3D IC Packaging

 

Registration

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