- Date：Apr 05, 2023
- Location： Americas
- Time： 2:30 PM EDT
2:30 PM EDT | Wednesday, April 5, 2023 | Check Your Time
Semiconductor chips and packages have become an integral part of our lives. Understanding the impact of IC packaging / encapsulation manufacturing process on the quality and performance of chips helps improve designs and reduce lead times. This webinar focuses on how the latest simulation technology can help designers and engineers understand different manufacturing processes and resolve potential defects such as voids, filler concentration, underfill / filet / overflow issues, wire shorting, package warp and others efficiently.
What Attendees Will Learn?
- What are the different processes followed in the industry for IC packaging and encapsulation
- How to use simulation to identify potential defects in encapsulation processes
- Correlation between simulation and molded parts