- Date：Sep 17, 2026 - Sep 19, 2026
- Location： New Delhi, India
- Time： 10:00 ~ 18:00
- Booth Number：Hall 2 H6619
- Official Website：https://www.semiconindia.org/
Moldex3D is excited to exhibit at SEMICON India 2026, one of India’s most influential events for the semiconductor and electronics industry. The event will take place from September 17 to 19, 2026, at Yashobhoomi (India International Convention & Expo Centre, IICC) in New Delhi. As India continues to accelerate its semiconductor and electronics manufacturing ecosystem, this premier event brings together industry leaders to explore the latest innovations shaping the future of the industry.
If you’re attending, be sure to visit Moldex3D at Hall 2 Booth H6619. Our experts will showcase the latest simulation solutions for IC Packaging and Advanced Display manufacturing. Discover how Moldex3D helps optimize compression molding, encapsulation, underfill, warpage prediction, and electronics potting, while supporting next generation display technologies with advanced material and process simulation.
Don’t miss this opportunity to experience the future of semiconductors. Learn how Moldex3D’s industry-leading simulation technologies help improve product quality, reduce development time, and accelerate innovation from design to production.
Show Information
| Date | Time | |
| September 17-19, 2026 | 10:00 ~ 18:00 (Last day will close at 17:00) | Pre-registration |
Venue
Yashobhoomi (India International Convention & Expo Centre, IICC)
( Sector 25 Dwarka, Dwarka, New Delhi, India )
Contact
Khaled EL Bchiri
Tel: +886 3 560 0199 ext. 614
khaled.bchiri@moldex3d.com
Claire Yang
Tel: +886 3 560 0199 ext. 641
claireyang@moldex3d.com