Plastics & Rubber Indonesia Virtual Expo 2021

Moldex3D will be participating in the Plastics & Rubber Indonesia Virtual Expo 2021 from December 1 through December 4 showcasing its latest version of software, Moldex3D 2021. The software features faster simulation speed and offers complete IC packaging simulation. Also will be exhibited are selected add-ons such as fiber material simulation, DOE, and SYNC. In order to embrace Industry 4.0, Moldex3D has launched machine characterization service which helps incorporate actual injection machine responses into CAE analysis, generating more realistic results. In addition, our expert will present this specific topic in the webinar on December 1 (5:00-6:00pm GMT+8) during the exhibition, don’t miss it! If you’d like to meet us in the virtual booth, use the form below to schedule an online meeting!


Yosua Tjokro Hindro
+886 3 560 0199 ext. 625

Claire Yang
+886 3 560 0199 ext. 641

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