ICP 15th IC Packaging Technology EXPO

CoreTech System Ltd. (Moldex3D) is going to be exhibiting at one of the biggest events for IC industry – IC Packaging Technology Expo from Jan 15th to 17th in Tokyo, Japan. This annual exhibition is exclusive for IC related industry with the visitors profile includes: Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc. Come to our booth E42-33 to see the latest technology and product offerings from leading plastics industry suppliers.

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