- Date：Jan 15, 2014 - Jan 17, 2014
- Location： Tokyo
- Booth Number：E42-33
- Official Website：https://www.icp-expo.jp/en/About/Outline/
CoreTech System Ltd. (Moldex3D) is going to be exhibiting at one of the biggest events for IC industry – IC Packaging Technology Expo from Jan 15th to 17th in Tokyo, Japan. This annual exhibition is exclusive for IC related industry with the visitors profile includes: Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc. Come to our booth E42-33 to see the latest technology and product offerings from leading plastics industry suppliers.