All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.

Exhibit Profile

  • Assembly Equipment
  • IC Packaging Materials/Components
  • Analysis/Simulation Software for IC Packaging
  • Various IC Packages
  • Inspection Equipment/Testers/Measurement for Semiconductor Device
  • SATS/Contract Design Services
  • Plating/Etching Technology
  • MEMS Packaging

CoreTech System(Moldex3D) is glad to announce we will be exhibiting at this exhibition, demonstrating the latest CAE simulation technology and application in IC industry. Make sure to stop by Moldex3D booth! We look forward to seeing you!

  • Venue: Tokyo Big Sight , Japan

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