Webinar: Digital Twin Data Management for IC Packaging Molding Process

  • Date:Jul 27, 2022
  • Location: Europe, Asia Pasific
  • Time: 10:00 AM CEST / 1:30 PM IST

10:00 AM CEST / 1:30 PM IST | Wednesday, July 27, 2022 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.


Semiconductor chips and packages have become an integral part of our lives. In the past few decades, the semiconductor manufacturing industry has gone through several technological innovations, led to the goal of increasing production capacity and reducing costs. The transformation cycle of innovation, and the semiconductor manufacturing side will benefit from the development of new technologies such as 5G, artificial intelligence (AI), cloud computing and big data analysis, virtual and augmented reality applications, and integrated knowledge networks, driving the semiconductor manufacturing industry towards the stage of Industry 4.0 and Smart Manufacturing.

This webinar focuses on digital transformation and smart manufacturing, we will discuss the application of Digital Twin and artificial intelligence (AI) in the semiconductor manufacturing industry from different perspectives and the prospects of semiconductor smart manufacturing in depth.

Webinar Highlights

  • Digital Twin-driven T-ZERO Production
  • Digital Twin Solution On IC Packaging Application



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