- Date：Oct 27, 2015
- Location： Singapore
IC packaging is the key technique in semiconductor manufacturing. To optimize IC packaging process can further help manufacturers achieve a lightweight design and reduce energy consumption. With our partner FTD Solutions, Moldex3D is going to hold a Molding Innovation Day seminar focusing on optimizing IC packaging design and manufacturing in Singapore. Do not miss out this chance to learn the key CAE simulation technology with our experts!
Agenda
| Time | Topic | Speaker |
| 8:30 – 9:00 | Registration | FTD Solutions |
| 9:00 – 9:10 | Opening remarks | FTD Solutions |
| 9:10 – 9:20 | CoreTech System Profile | Ms. Ruby Cheng Regional Manager CoreTech System |
| 9:20 – 10:15 | Latest advanced packaging trends in flip chip and wafer level packaging | Mr. Jim Hsu Project Manager CoreTech System |
| 10:15 – 10.30 | Coffee Break | |
| 10:30 – 11:15 | Insight of IC materials and optimize your design by using Moldex3D | Mr. Jim Hsu Project Manager CoreTech System |
| 11:15 – 12:00 | TBA | FTD Solutions |
| 12:00 – 13:00 | Lunch |
Venue
Singapore Holiday Inn Atrium
317 Outram Road, Singapore 169075
Tel +65 67331088
Contact
- Mr. Satish K
Email: satish@ftdsolutions.com
Phone: +(65)64882467
Mobile: +(65)81838996 - Mr. Brandon Liu
Email: brandonliu@moldex3d.com