Molding Innovation Day 2023 – University of Louisville

  • Date:Aug 10, 2023
  • Location: Louisville, KY, USA

Join us for a remarkable event as Moldex3D and the University of Louisville collaborate to co-host the Molding Innovation Day on August 10, 2023. This extraordinary gathering aims to delve into the forefront of simulation solutions, specifically customized to address the prevailing challenges in the realm of injection molding. To enhance the overall experience, an engaging half-day workshop will be organized, offering participants invaluable insights and expert guidance facilitated by the esteemed professionals at Moldex3D.

The best part? Admission to this event is completely free, ensuring accessibility to all individuals with an interest in the subject matter. And all current non-users who attend will receive a 1-month trial license. Moreover, at the end of the event, we will be hosting a raffle activity. Don’t miss out on this opportunity to not only gain valuable insights but also have a chance to win fantastic rewards.

Agenda

Time (EDT) Session Presenter
8:30 AM – 9:00 AM Arrival/Sign-In  
9:00 AM – 9:05 AM Introduction Louisville
9:05 AM – 9:35 AM Predict and Solve Stress Marks on Product’s Cosmetic Surface Using Controlled Sequential Valve Gating Simulation Moldex3D
9:35 AM – 10:05 AM 3D printing of Molds for Injection Molding Louisville
10:05 AM – 10:35 AM Simulation Validation: A look inside a mold with cavity pressure monitoring Prudent American
10:35 AM – 10:50 AM Break  
10:50 AM – 11:20 AM A Study in Additive Conformal Cooling Anova
11:20 AM – 11:50 AM Navigating Mold Compensation / Windage with Moldex3D Moldex3D
11:50 AM – 12:30 PM Introduction of MBDA and Tour of the Facility Louisville
12:30 PM – 01:30 PM Lunch  
 Hands-on Workshop 
1:30 PM – 2:45 PM Quick Demo of Moldex3D
Pre-Processing
– CADDoctor
– Meshing Best Practices
– Advantages of Boundary Layer Meshing (BLM)
Moldex3D
2:45 PM – 3:00 PM Break  
3:00 PM – 4:30 PM Project Setup
– Best Practices
– Standard Simulation Workflow
– Result Interpretation
– Studio Demo
Moldex3D
4:30 PM – 5:00 PM Q&A Moldex3D

 

Raffle

By the end of the Conference, we will also have a raffle among the attendees.

Sony WH-CH720N
Noise Canceling Wireless Headphones(goods value $148)

 

Venue

University of Louisville
Sackett Hall, room 213
332 Eastern Pkwy, Louisville, KY 40208

Contact

Srikar Vallury
E: sales.us@moldex3d.com
P: (248)-990-7712


Test drive Moldex3D

Join the thousands of companies using Moldex3D

Talk to Sales

Schedule a product demo with our sales team