- Date：May 18, 2022
- Location： Online
Manufacturing of components used in the electronics industry involves complex processes such as underfill and potting. We often find ourselves running into part quality challenges such as voids and warpage during these processes, but this is something we can change.
You just have to know how.
Attend Virtual Café for Electronics Manufacturing Simulation on May 18, where you can discover better and more efficient ways to deal with defects. During our four sessions, you will learn how to simulate and visualize potential defects and capillary driven flow with Moldex3D. We will also demonstrate IC automeshing, which provides time efficiency for tedious model preparation.
Register today for great molding tips and tricks!
Agenda
| Time (PST) | Session | Presenter |
| 09:00 AM – 09:10 AM | Log-in | |
| 09:10 AM – 09:15 AM | Introduction | Moldex3D |
| 09:15 AM – 09:45 AM | Overview of IC Packaging and Encapsulation Simulation Capabilities | Moldex3D |
| 09:45 AM – 10:15 AM | Warpage and Void Simulations of System in Package | STATS ChipPAC |
| 10:15 AM – 10:45 AM | Simulating Capillary Driven Flow with Moldex3D | Moldex3D |
| 10:45 AM – 11:30 AM | Demo of Moldex3D’s IC Automeshing Solution | Moldex3D |
| 11:30 AM – 12:00 PM | Q&A – | |
Contact
Srikar Vallury
E: sales.us@moldex3d.com
P: 248-946-4570 ext. 991