- Date：Aug 26, 2021
- Location： Online
Manufacturing of components used in the electronics industry involves complex processes such as underfill and potting. Challenges faced during such processes often include part quality issues such as voids and warpage. During this session, attendees will learn how to simulate and visualize such potential defects using Moldex3D. A demo on IC automeshing will also be provided in this session.
Agenda
| Time (PST) | Session | Presenter |
| 09:00 AM – 09:20 AM | Log-in | |
| 09:20 AM – 09:25 AM | Introduction | Moldex3D |
| 09:25 AM – 09:55 AM | Overview of IC Packaging and Encapsulation Simulation Capabilities | Moldex3D |
| 09:55 AM – 10:25 AM | Warpage and Void Simulations of System in Package | Statschippac |
| 10:25 AM – 10:55 AM | Simulating Capillary Driven Flow with Moldex3D | Moldex3D |
| 10:55 AM – 11:55 AM | Demo of Moldex3D’s IC Automeshing Solution | Moldex3D |
| 11:55 AM – 12:30 PM | Q&A – | |
Contact
Srikar Vallury
E: sales.us@moldex3d.com
P: 248-946-4570 ext. 991