- Date：Jul 25, 2016 - Jul 27, 2016
- Location： CA, USA
With an increasing demand for smaller and more sophisticated electronic products, achieving excellent part quality has become more challenging; thus, increasing the focus on IC Packaging encapsulation process. Moldex3D IC Packaging Simulation Workshop will showcase how Moldex3D, using it’s fully 3D IC Packaging module, can be used to help optimize part / mold design effectively.
Highlights of this workshop include in-depth discussions on Moldex3Ds capabilities and also presentations by companies from the IC Packaging industry such as Towa and Neu Dynamics.
The workshop will be followed by an optional 2-day training session which would allow users to experience Moldex3D’s IC Packaging module hands-on. The training session includes pre-processing, setting up an analysis and also post-processing.
Agenda
| Time | Topic | Speaker |
| 8:45 AM – 9:00 AM | Registration | |
| 9:00 AM – 10:00 AM | Introduction to Moldex3Ds IC Packaging capabilities -Wire Sweep / Underfill / Paddle Shift -Voids / Air Traps / Short Shots -Case Studies for Design / Molding Optimization |
Moldex3D |
| 10:00 AM – 10:30 AM | SiP Module Moldability DOE Project of iNEMI | TBD |
| 10:30 AM – 10:45 AM | Break | |
| 10:45 AM – 11:15 AM | Presentation | Neu Dynamics |
| 11:15 AM – 11:45 AM | Moldex3D’s Solution for Process Induced Stress and Warpage Simulation of IC Packaging | Moldex3D |
| 12:00 PM – 1:00 PM | Lunch | |
| 1:00 PM – 1:30 PM | Molding Packaging Solutions and Innovations | Towa |
| 1:30 PM – 2:00 PM | Material Properties and Material Testing with Moldex3D | Moldex3D |
| 2:00 PM – 2:30 PM | Moldex3D Development and Technology Roadmap for IC Packaging in R15 | Moldex3D |
| 2:30 PM – 3:00 PM | Networking / Q & A |
Venue
STATS ChipPAC Inc.
46429 Landing Parkway, Fremont, CA 94538 USA
Contact
For any questions including software inquiries, please contact Srikar Vallury at srikarvallury@moldex3d.com
Phone: (248) 946-4570