• Date：Sep 27, 2013 - Dec 20, 2017
• Location： Singapore

Address: 31 Kaki Bukit Rd 3 Techlink #05-20/3 S 417818
Time: 10am – 2pm

Expected Achievement for Participant:

• Capability to Save Cost by Reducing Wastage
• Enhance Customer Satisfaction thru Better Product Quality
• Improve Response thru Shorten Cycle Time
• Use Industry Proven Tool to help Create More Innovative Products

Agenda

• Mold Design Process & Innovation
• Mold Simulation to Improve Time to Market and Product Quality
• Industry Best Practice & Case Studies Presentation
• Round Table Discussion
• Hands-on Test Drive

Contact

emilywu@moldex3d.com  / emilyoyk@hitachi-sunway-is.com