- Date：Sep 17, 2013
- Location： Suzhou, Jiangsu
While pursuing weight reduction, high efficiency and reliability, and lower cost, people equip digital products with more and more functions than ever. To fulfill human’s desire, IC packaging industry has encountered the challenges of shortening the cycle time and solving product defects such as air trap, short shot, wire sweep and paddle shift. The critical standards for dimensional stability and for mechanical structure couple with the development of 3D IC packaging have driven the underfill process to be the point of IC industry nowadays. To solve the issues and further improve the competitiveness, we sincerely invite you to participate in this seminar to absorb not only the novel technology but also the experiences that come from cross-strait industry leaders, scholars and professionals.
| Time | Content | Speaker |
| 13:00 – 13:30 | Sign-in | |
| 13:30 – 14:10 | Compression Molding in 3D IC Packaging | CoreTech System |
| 14:10 – 15:00 | Introduce Simulation Analysis to Enhance Package Yield: Underfill | CoreTech System |
| 15:10 – 15:20 | Break | |
| 15:20 – 15:50 | Innovate IC Product Design via Cost-Effective Simulation Tools | SIMULIA |
| 15:50 – 16:30 | Visualize DOE and validate the design: In Mold Cure and Post Mold Cur | CoreTech System |
| 16:30 – 17:00 | Discussion | |
Information
- Location： All Seasons Hotel, 3rd Floor, Four Season Room – No.158 Pinglong Road, Pingjiang District, Suzhou 215031, China
- Date： 2013/09/17(Tue)
- Time： 13:00pm ~ 17:00 pm
- Tel: +86-512-6288-7663 ext.802
Contact
- Jane Wu
- janewu@moldex3d.com