Innovation Success for Advanced IC Packaging

  • Date:Sep 17, 2013
  • Location: Suzhou, Jiangsu

While pursuing weight reduction, high efficiency and reliability, and lower cost, people equip digital products with more and more functions than ever. To fulfill human’s desire, IC packaging industry has encountered the challenges of shortening the cycle time and solving product defects such as air trap, short shot, wire sweep and paddle shift. The critical standards for dimensional stability and for mechanical structure couple with the development of 3D IC packaging have driven the underfill process to be the point of IC industry nowadays. To solve the issues and further improve the competitiveness, we sincerely invite you to participate in this seminar to absorb not only the novel technology but also the experiences that come from cross-strait industry leaders, scholars and professionals.

Time Content Speaker
13:00 – 13:30 Sign-in
13:30 – 14:10 Compression Molding in 3D IC Packaging CoreTech System
14:10 – 15:00 Introduce Simulation Analysis to Enhance Package Yield: Underfill CoreTech System
15:10 – 15:20 Break  
15:20 – 15:50 Innovate IC Product Design via Cost-Effective Simulation Tools SIMULIA
15:50 – 16:30 Visualize DOE and validate the design: In Mold Cure and Post Mold Cur CoreTech System
16:30 – 17:00 Discussion


  • Location: All Seasons Hotel, 3rd Floor, Four Season Room – No.158 Pinglong Road, Pingjiang District, Suzhou 215031, China
  • Date: 2013/09/17(Tue)
  • Time: 13:00pm ~ 17:00 pm
  • Tel: +86-512-6288-7663 ext.802


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