- Date：Oct 27, 2015 - Oct 28, 2015
- Location： Orlando, FL, USA
- Booth Number：104
- Official Website：https://www.imaps.org/imaps2015/index.htm
Moldex3D is delighted to announce that we will participate in the upcoming IMPAS 2015 from October 27 to 28, 2015 in Orlando, FL. The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This event will bring together the entire microelectronics/packaging supply chain under one roof. And, the latest research findings that present progress on the technologies throughout the entire microelectronics/packaging supply chain will be showcased in the symposium.
Moldex3D will be co-exhibiting with our partnering company, Neu Dynamics at Booth#: 104 at this premier event. At IMPAS 2015, Moldex3D will present a unique solution to help professionals of IC package mold design, IC packaging and testing industries produce best quality products while fitting the trend of higher packaging densities with thinner and smaller profiles. In addition to booth exhibits, Moldex3D will present our latest research study on “Visualize 3D warpage behavior in post-mold cure stage using advanced CAE technology” in the symposium.
We sincerely invite you to visit our booth at #104 to talk to our professionals. Bring any questions you have for microchip encapsulation to our booth, and let’s discuss what we can do to make your encapsulation process perfect the first time!
Venue
Rosen Centre Hotel
9840 International Dr, Orlando, FL 32819 USA
Contact
Srikar Vallury
srikarvallury@moldex3d.com