• Date：Mar 05, 2014
• Location： Online

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion.

Moldex3D IC Packaging provides a complete series of molding solutions that help engineers to simulate the complex chip encapsulation process, validate mold design, and optimize process conditions.

Moldex3D would love to share the knowledge and expand IC Packaging market in EU. This webinar is designed to introduce the IC technology and help our EU VAR teams get wider range of prospects and business opportunities in the IC Packaging industry.

The highlight of the webinar will be the presence of Mr. Rick Wu – Special Assistant of Chairman, responsible for IC Packaging Business Unit in Moldex3D.

Mr. Wu is a well known IC expert and has years of experience, working for companies such as  Taiwan ESD Association, Standard Technology, Integrated Service Technology, SIEMENS and Taiwan Semiconductor Manufacturing Company.

He specializes in the following:

• EDA software development
• Reliability engineering
• Lead-free process validation
• Material analysis
• Semiconductor test engineering
• Semiconductor failure analysis

Content of the webinar:

• Introduction of IC Packaging
• IC Packaging process and corresponding module of Moldex3D
• Common defects in IC packaging process
• Moldex3D Solutions for Advanced IC Packaging
• Customer success story
• Q&A

Make sure you there!

Contact

emmatracz@moldex3d.com
Emma Tracz