Electronic Components and Technology Conference (ECTC) 2021

in Past Events on 06/11/2021
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. 

Due to the COVID 19 pandemic, ECTC 2021 is held online from June 1 to July 4. People can join the event by registering at http://ectc.net/registration/index.cfm for the latest IC packaging technology shared by the experts from around the world.

Moldex3D is sharing two technical articles with our partners at the event. We sincerely invite you to join our sessions and exchange ideas with us!

Moldex3D’s Speaking Sessions

Session 4: Heterogeneous Integration Using 2.xD/3D Packaging Technologies

  • Committee: Packaging Technologies
  • 4. 2.2D Die last Integrated Substrate for High Performance Applications

    Dyi Chung Hu – SiPlus Co.
    Er Hao Chen – SiPlus Co.
    Jeffrey ChangBing Lee – iST-Integrated Service Technology Inc.
    Chia Peng Sun – CoreTech System (Moldex3D)
    Chih Chung Hsu – CoreTech System (Moldex3D) 

Session 44: Thermo-Mechanical Analysis for Reliability in Packaging Technology

  • Committee: Interactive Presentations Technical
  • Warpage of Compression Molded SiP Strips

    Eric Ouyang – JCET Global
    Yonghyuk Jeong – JCET Global
    JaeMyong Kim – JCET Global
    JaePil Kim – JCET Global
    OhYoung Kwon – JCET Global
    Michael Liu – JCET Global
    Susan Lin – CoreTech System (Moldex3D)
    Jenn An Wang – CoreTech System (Moldex3D)
    Anthony Yang – CoreTech System (Moldex3D)
    Eric Yang – CoreTech System (Moldex3D)

 

For more information, please go to https://www.ectc.net/program/index.cfm

 


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