MOLDEX-3D

Date	Event Name	Location	Event Type
Oct 27, 2021	Webinar: Advanced IC Package Simulation in Moldex3D	Europe, Asia Pasific	Webinar
Nov 02, 2021 － Nov 04, 2021	SPE ACCE 2021	Novi, MI, USA	Trade Shows
Nov 10, 2021	Webinar: Shrinkage and Warpage, Cause and Solution	Americas	Webinar
Dec 02, 2021 － Dec 05, 2021	Healthcare+ Expo Taiwan 2021	Taipei, Taiwan	Trade Shows
Dec 15, 2021 － Dec 18, 2021	TAIMOLD 2021	Taipei, Taiwan	Trade Shows
Dec 28, 2021 － Dec 30, 2021	SEMICON Taiwan 2021	Taipei, Taiwan	Trade Shows

• • Date
  • Event Name
  • Location
  • Event Type
• • Date: Oct 27, 2021
  • Event Name: Webinar: Advanced IC Package Simulation in Moldex3D
  • Location: Europe, Asia Pasific
  • Event Type: Webinar
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• • Date: Nov 02, 2021 － Nov 04, 2021
  • Event Name: SPE ACCE 2021
  • Location: Novi, MI, USA
  • Event Type: Trade Shows
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• • Date: Nov 10, 2021
  • Event Name: Webinar: Shrinkage and Warpage, Cause and Solution
  • Location: Americas
  • Event Type: Webinar
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• • Date: Dec 02, 2021 － Dec 05, 2021
  • Event Name: Healthcare+ Expo Taiwan 2021
  • Location: Taipei, Taiwan
  • Event Type: Trade Shows
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• • Date: Dec 15, 2021 － Dec 18, 2021
  • Event Name: TAIMOLD 2021
  • Location: Taipei, Taiwan
  • Event Type: Trade Shows
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• • Date: Dec 28, 2021 － Dec 30, 2021
  • Event Name: SEMICON Taiwan 2021
  • Location: Taipei, Taiwan
  • Event Type: Trade Shows
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