| Date | Event Name | Location | Event Type |
|
Jun 21, 2023
－ Jun 24, 2023 |
InterMold Thailand 2023 | Thailand | Past Events |
| Jun 21, 2023 | Webinar: Improving Simulation Efficiency with API | Europe, Asia Pasific | Past Events |
| Jun 20, 2023 | Molding Innovation Day – Italy 2023 | Lazise, Italy | Past Events |
| Jun 16, 2023 | India Molding Innovation Day 2023 – More Sensitive IC Packaging Simulations with Moldex3D User friendly Solver | India | Past Events |
| Jun 15, 2023 | Vietnamese Webinar Series 2023: Cải thiện độ bền Đường hàn thông qua Mô phỏng khuôn ép phun | Vietnam | Past Events |
| Jun 14, 2023 | Webinar: iMFLUX_Simulation of the Green Curve | Americas | Past Events |
| Jun 08, 2023 | Molding Innovation Day Buffalo 2023 – Compuplast | Depew, NY, USA | Past Events |
| Jun 07, 2023 | Webinar: Benefiting from Material Digital Twin | Europe, Asia Pasific | Past Events |
| Jun 06, 2023 | Hands-on Workshop: Simulation Data Management – using iSLM Personal version | Leiria, Portugal | Past Events |
| May 31, 2023 | Webinar: Lightweighting II : Material Displacement Strategies | Americas | Past Events |
| May 29, 2023 | India Molding Innovation Day 2023 – Light Weighting Technology Simulation Using Moldex3D | India | Past Events |
| May 24, 2023 | Webinar: What’s New in Material Hub Cloud 2023 | Europe, Asia Pasific | Past Events |
|
May 23, 2023
－ May 26, 2023 |
Plastpol 2023 | Kielce, Poland | Past Events |
| May 19, 2023 | India Molding Innovation Day 2023 – Subtract Molding defects by adding Smart Moldex3D Solver | India | Past Events |
| May 18, 2023 | Vietnamese Webinar Series 2023: Giảm cong vênh thông qua Mô phỏng | Vietnam | Past Events |
-
- Date
- Event Name
- Location
- Event Type
-
- Jun 21, 2023 － Jun 24, 2023
- InterMold Thailand 2023
- Thailand
- Past Events
-
- Jun 21, 2023
- Webinar: Improving Simulation Efficiency with API
- Europe, Asia Pasific
- Past Events
-
- Jun 20, 2023
- Molding Innovation Day – Italy 2023
- Lazise, Italy
- Past Events
-
- Jun 16, 2023
- India Molding Innovation Day 2023 – More Sensitive IC Packaging Simulations with Moldex3D User friendly Solver
- India
- Past Events
-
- Jun 15, 2023
- Vietnamese Webinar Series 2023: Cải thiện độ bền Đường hàn thông qua Mô phỏng khuôn ép phun
- Vietnam
- Past Events
-
- Jun 14, 2023
- Webinar: iMFLUX_Simulation of the Green Curve
- Americas
- Past Events
-
- Jun 08, 2023
- Molding Innovation Day Buffalo 2023 – Compuplast
- Depew, NY, USA
- Past Events
-
- Jun 07, 2023
- Webinar: Benefiting from Material Digital Twin
- Europe, Asia Pasific
- Past Events
-
- Jun 06, 2023
- Hands-on Workshop: Simulation Data Management – using iSLM Personal version
- Leiria, Portugal
- Past Events
-
- May 31, 2023
- Webinar: Lightweighting II : Material Displacement Strategies
- Americas
- Past Events
-
- May 29, 2023
- India Molding Innovation Day 2023 – Light Weighting Technology Simulation Using Moldex3D
- India
- Past Events
-
- May 24, 2023
- Webinar: What’s New in Material Hub Cloud 2023
- Europe, Asia Pasific
- Past Events
-
- May 23, 2023 － May 26, 2023
- Plastpol 2023
- Kielce, Poland
- Past Events
-
- May 19, 2023
- India Molding Innovation Day 2023 – Subtract Molding defects by adding Smart Moldex3D Solver
- India
- Past Events
-
- May 18, 2023
- Vietnamese Webinar Series 2023: Giảm cong vênh thông qua Mô phỏng
- Vietnam
- Past Events