- Date：Feb 09, 2017
- Location： Altair Headquarters, Troy, MI, USA
- Official Website：https://www.altairatc.com/EventHome.aspx?event_id=92
This year, CoreTech System (Moldex3D) will be attending ATCx: OptiStruct Conference taking place on February 9, 2017 at the Altair Headquarters. This event will bring structural engineers and CAE engineers together to hear about the latest product updates on Optistruct 14.0, and learn from industry experts as they discuss the cutting edge simulation solutions to overcome real-world design and manufacturing challenges. Alex Baker from Moldex3D will talk about the tight integration between Moldex3D and OptiStruct to help engineers shorten the gap between actual production and structural analyses by mapping Moldex3D injection molding simulation results to structural analysis solver OptiStruct using Moldex3D FEA Interface.
Be sure to find us at the exhibitor area and attend Moldex3D’s presentation to explore a broad range of simulation solutions provided by Moldex3D to help you open up new potential for quality and efficiency!
Moldex3D Speaking Session
- Title: Interfacing Molding Simulation and Structure Analysis for Mold Design Evaluation Using Moldex3D and OptiStruct
- Date: February 9, 2017
- Time: 11:45 am-12:10 pm
- Presenter: Alex Baker, Application Engineer at Moldex3D Northern American Inc.