Molding Innovation Day Buffalo 2023 – Compuplast

Date：Jun 08, 2023
Location： Depew, NY, USA

Moldex3D and Compuplast will be co-hosting the Molding Innovation Day on June 8th, 2023. This seminar will focus on the latest advancements in simulation solutions for addressing common injection molding challenges. Additionally, there will be a half-day hands-on workshop led by Moldex3D experts.

Participation in the event is free of charge. And all current non-users who attend will receive a 1-month trial license. Moreover, at the end of the event, we will be hosting a raffle activity. Don’t miss out on this opportunity to not only gain valuable insights but also have a chance to win fantastic rewards.

Agenda

Time (EDT)	Session	Presenter
8:30 AM – 9:00 AM	Arrival/Sign-In
9:00 AM – 9:05 AM	Introduction	Compuplast
9:05 AM – 9:35 AM	Predict and Solve Stress Marks on Product’s Cosmetic Surface Using Controlled Sequential Value Gating Simulation	Moldex3D
9:35 AM – 10:05 AM	Simulating on the Green Curve – the iMFLUX process	iMFLUX
10:05 AM – 10:35 AM	Injection Molding Screw Analysis and Optimization	Compuplast
10:35 AM – 10:50 AM	Break
10:50 AM – 11:20 AM	Moldex3D Warpage Analysis and Visualization Techniques	Moldex3D
11:20 AM – 11:50 AM	Advanced Hot Runner Flow Balancing-Improving Plastic Molding and Sustainability	Polyshot
11:50 AM – 12:30 PM	Navigating Mold Compensation / Windage with Moldex3D	Moldex3D
12:30 PM – 01:30 PM	Lunch
Hands-on Workshop
1:30 PM – 2:45 PM	Quick Demo of Moldex3D Pre-Processing – CADDoctor – Meshing Best Practices – Advantages of Boundary Layer Meshing (BLM)	Moldex3D
2:45 PM – 3:00 PM	Break
3:00 PM – 4:30 PM	Project Setup – Best Practices – Standard Simulation Workflow – Result Interpretation – Studio Demo	Moldex3D
4:30 PM –	Q&A	Moldex3D