Molding Innovation Day 2021: Online, Singapore and Malaysia

  • Date:Oct 26, 2021
  • Location: Online



Explore Moldex3D Solutions for IC Packaging Simulation

Plastic chip encapsulation is a molding process where chips are being capsulated with epoxy molding compound (EMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Moldex3D IC Packaging provides a complete series of molding solutions that help engineers to simulate the complex chip encapsulation process, validate mold design, and optimize process conditions.

Join now to learn how to simulate and visualize such potential defects using Moldex3D. A demo on IC automeshing will also be provided in this session. Don’t miss your chance to register!



Time Session Presenter
02:00 PM – 02:05 PM Introduction Moldex3D
02:05 PM – 02:35 PM Overview of IC Packaging and Encapsulation Simulation Capabilities Moldex3D
02:35 PM – 03:05 PM Simulating Capillary Driven Flow with Moldex3D Moldex3D
03:05 PM – 03:35 PM Automated Molding Simulation and Data Management for IC Packaging Industry in iSLM Platform Moldex3D
03:35 PM – 04:05 PM Demo of Moldex3D’s IC Automeshing Solution Moldex3D
04:05 AM – 04:30 PM Q&A – Moldex3D



Sales & Technical Contact
Steven Lin

Event & Marketing Contact
Claire Yang

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