- Date:Oct 26, 2021
- Location: Online
Description
Explore Moldex3D Solutions for IC Packaging Simulation
Plastic chip encapsulation is a molding process where chips are being capsulated with epoxy molding compound (EMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.
Moldex3D IC Packaging provides a complete series of molding solutions that help engineers to simulate the complex chip encapsulation process, validate mold design, and optimize process conditions.
Join now to learn how to simulate and visualize such potential defects using Moldex3D. A demo on IC automeshing will also be provided in this session. Don’t miss your chance to register!
Agenda
Time | Session | Presenter |
02:00 PM – 02:05 PM | Introduction | Moldex3D |
02:05 PM – 02:35 PM | Overview of IC Packaging and Encapsulation Simulation Capabilities | Moldex3D |
02:35 PM – 03:05 PM | Simulating Capillary Driven Flow with Moldex3D | Moldex3D |
03:05 PM – 03:35 PM | Automated Molding Simulation and Data Management for IC Packaging Industry in iSLM Platform | Moldex3D |
03:35 PM – 04:05 PM | Demo of Moldex3D’s IC Automeshing Solution | Moldex3D |
04:05 AM – 04:30 PM | Q&A – | Moldex3D |
Contact
Sales & Technical Contact
Steven Lin
stevenlin@moldex3d.com
Event & Marketing Contact
Claire Yang
claireyang@moldex3d.com