ECTC 2014

  • Date:May 28, 2014 - May 29, 2014
  • Location: Orlando, FL, USA
  • Booth Number:#211
  • Official Website:

Moldex3D, the largest independent CAE software provider for microchip encapsulation process, is pleased to announce we will be returning to exhibit at the Electronic Components and Technology Conference (ECTC) 2014, held in Orlando, FL. We would like to take this opportunity to invite IC Packaging industry professionals to visit us at booth #211 and also join us in our technical paper presentation on the topic of “A Novel Method to Predict Fluid/Structure Interaction in IC Packaging” on Friday, May 30, 2014.


Technical Paper Presentation

  • Friday, May 30, 2014
  • Session 28: System-Level Thermal & Mechanical Models II
  • 11:15 AM – A Novel Method to Predict Fluid/Structure Interaction in IC Packaging
  • Committee: Modeling & Simulation
  • Room: Southern Hemisphere IV
  • Author(s): Chih-Chung Hsu – National Tsing Hua University
                        Tzu-Chang Wang – CoreTech System (Moldex3D) Co., Ltd.
                        Yen-Chi Chen – CoreTech System (Moldex3D) Co., Ltd.
                        Yang-Kai Lin – CoreTech System (Moldex3D) Co., Ltd.

Exhibit Hours

  Date Time
Wednesday May 28 9:00am -12:00pm
Thursday May 29 9:00am -12:00pm

ECTC is the premier international packaging, components, and microelectronic systems technology conference, offering an outstanding array of packaging technology information. Held annually, ECTC attracts more than 800 attendees and 60 exhibiting companies representing countries from Asia, Europe, and United States.

As the need for highly sophisticated and ever-smaller electronic products is dramatically growing, it has made IC packaging a more challenging procedure than ever. At ECTC, Moldex3D will offer a unique solution to help professionals of IC package mold design, IC packaging and testing industries produce best quality product while fitting the trend of higher packaging densities with thinner and smaller profiles. Moldex3D’s IC Package module is a fully integrated analysis environment connecting pre-processing, post-processing, mold filling and structural analyses for microchip encapsulation simulation. Through IC Package module of Moldex3D, users are empowered to predict how the mold will be filled, identify air traps and weld lines positions, and evaluate the runner and gate design with the best-in-class 3D interactive visualization technology. By using the integrated simulation analysis, potential molding defects, including die crack, addle shift, wire sweep, and many others can be easily detected to improve and optimize the molding process to minimize manufacturing cost and design cycle time.

Bring any questions you have for microchip encapsulation to us at booth #211, Moldex3D’s experienced elites will show you how to make your encapsulation process perfect the first time.


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