Semiconductor

The surge in artificial intelligence, virtual and augmented reality, and autonomous driving has boosted robust growth of advanced packaging technologies in semiconductors. To meet the demands for miniaturization and high integration, advanced packaging technologies continue to evolve—bringing with them new challenges.

Simulate to Innovate

We provide solutions tailored for your products.

Raise Every Moldability

Simulation helps address common issues in IC packaging, successfully improving flow behavior and resolving problems such as weld lines and air traps.
Success Story
Wire Wizard and Wire Template assist users in importing tiny wire components during pre-processing, speeding up wire design and creation.
Tech Insight
Moldex3D Electronics Potting simulation makes it possible to model the fluid dynamics during the potting process, predicting the location and size of air traps.
Tech Insight
By simulating thermal cycling tests and optimizing designs based on the predicted thermal cycle time, it helps accelerate the workflow and reduce development costs.
Tech Insight
The simplified and standardized modeling process of IC Packaging simulation in Moldex3D iSLM helps reduce the effort and time spent on routine tasks.
Tech Insight

Address Industry Pain Points

IC Packaging

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) or Liquid Molding Compound (LMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Learn more about Moldex3D IC Packaging ≫

Electronics Potting

Prevalent applications of electronics potting include board-level encapsulation, wound rotor of motors, etc. Challenges such as air trapping, thermal effects of phase transition, and residual stress accumulated from chemical shrinkage need to be addressed during the potting process. These factors can impact product lifespan and reliability.

Learn more about Moldex3D Electronics Potting ≫

Industry Insights

Get straight to the crux.

Simulate Your Future with Moldex3D

Reliable Technology

Moldex3D offers industry-leading true 3D simulation technology. To keep up with various industry trends, we provide a wide range of simulation solutions for advanced molding processes. With an R&D team of over 100 experts, all core technologies are independently developed. Our Material Center is ISO17025 certified and houses a database of more than 9,000.

Comprehensive Services

With 15 direct offices worldwide and over 300 sales channel locations, we deliver timely and complete support. Currently, our products include Moldex3D, the plastic injection molding simulation software; Moldiverse, the innovative molding cloud platform; material and machine characterization services; and iSLM, the data management platform.

Solutions by Industry

Automotive
Electronics
Semiconductor
Optics
Manufacturing
Consumer Goods
Medical
Hot Runner
Plastics Material
Aerospace

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