Moldex3D Workshop 2018 – IC Packaging & Injection Molding

  • Date:Aug 15, 2018
  • Location: Livermore, CA, USA

Moldex3D IC Packaging + Injection Molding Workshop on Aug 15 at Livermore Software Technology Corporation (LSTC) in Livermore, California.  There will be 2 sessions for the day – IC Packaging in the morning, and Injection Molding in the afternoon. The event is totally FREE. We sincerely invite you to join this workshop! Chat with our professional experts and find out how our innovative solutions can help you design better products.


Morning Session – IC Packaging

This session, we will show how Moldex3D can help you predict, prevent, and avoid critical molding challenges related to IC packaging such as stress and warpage, improving chip quality and prevent potential defects more efficiently.
In addition, as the diameter of the strand becomes smaller, ensuring the integrity of wire placement during the IC packaging process becomes a challenge. But don’t worry, Moldex3D IC Packaging module provides a convenient tool to utilize stress solvers to predict wire sweep, and the results in Moldex3D Project can be displayed directly.


Afternoon Session – Injection Molding

Want to learn about the latest trends of Mold Filling CAE Technology? And see how can CAE tool help you overcome the warping problems and improve the product quality? Then you must not miss this workshop. In this half day session, Our professional experts will share their industry knowledge and how the latest version of Moldex3D R16 helps users optimize the overall simulation analysis process.

In addition, accurate material data is one of the important factors in successful simulation and injection molding product development. We will introduce the methods and instruments used in the current ISO 17025 certified Moldex3D Material Testing Lab, and how the Moldex3D uses information from material testing to help you get accurate simulation results.

Seats are limited.  Register today.




Morning Session – IC Packaging

8:30 – 9:00 AM Registration – IC
9:00 – 9:30 AM Introduction to Moldex3D’s IC Packaging Capabilities
– Case Studies for Design / Molding Optimization
9:30 – 10:00 AM Moldex3D’s Solution for Process Induced Stress and Warpage in IC Packaging Moldex3D
10:00 – 10:30 AM The Latest Simulation Technology of Capillary Underfill Process Moldex3D
10:30 – 10:45 AM Break
10:45 – 11:15 AM Transfer Molding Simulation of IC Packaging – A Case Study Neu Dynamics
11:15 – 12:00 AM – Material Data in Moldex3D for IC Packaging
– Future of IC Packaging Simulations with Moldex3D
12:00 – 1:00 PM Lunch


Afternoon Session – Injection Molding

1:00 – 1:30 PM Registration – IM
1:30 – 200 PM The Latest Trends of Mold Filling CAE Technology Moldex3D
2:00 – 2:30 PM Latest Material Modeling and Characterization Capabilities Moldex3D
2:30 – 3:00 PM Recent development of carbon fiber composite modeling in LS-Dyna LSTC
3:00 – 3:15 PM Break
3:15 – 3:45 PM A Robust, Fast & Easy Way to Integrate Manufacturing Effects into FEA e-Xstream Engineering
(MSC Software)
3:45 – 4:15 PM Moldex3D’s Latest Achievements on Warpage Predictions Moldex3D
4:15 – 5:00 PM Moldex3D Around the Globe – Successful Case Studies from Real-World Applications Moldex3D
5:05 PM Networking


Livermore Software Technology Corporation (LSTC)
7374 Las Positas Road, Livermore, CA 94551


Kiki Kratzer
T: 248-946-4570 ext. 327

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